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Issue No.04 - July/August (2009 vol.29)
pp: 62-73
Paul Rosenberg , Hewlett-Packard
Jong-Souk Yeo , Hewlett-Packard
Moray McLaren , Hewlett-Packard
Sagi Mathai , Hewlett-Packard
Terry Morris , Hewlett-Packard
Michael R.T. Tan , Hewlett-Packard
Joseph Straznicky , Hewlett-Packard
Norman P. Jouppi , Hewlett-Packard
Shih-Yuan Wang , Hewlett-Packard
<p>Signal integrity constraints of high-speed electronics have made multidrop electrical buses infeasible. This high-speed alternative uses hollow metal waveguides and pellicle beam splitters that interconnect modules attached to the bus. With 1 mW of laser power, the bus can interconnect eight modules at 10 Gbps per channel and achieves an aggregate bandwidth of more than 25 Gbytes per second with 10-bit-wide signaling paths.</p>
I/O and data communications, buses, multicast, optical interconnects, interprocessor communications, interconnection architectures, fiber optics, memory wall, hardware
Paul Rosenberg, Jong-Souk Yeo, Moray McLaren, Sagi Mathai, Terry Morris, Michael R.T. Tan, Joseph Straznicky, Norman P. Jouppi, Shih-Yuan Wang, "A High-Speed Optical Multidrop Bus for Computer Interconnections", IEEE Micro, vol.29, no. 4, pp. 62-73, July/August 2009, doi:10.1109/MM.2009.57
1. W.J. Dally and J.W. Poulton, Digital Systems Engineering, Cambridge Univ. Press, 1998.
2. M. Graham and H. Johnson, High-Speed Signal Propagation—Advanced Black Magic, Prentice Hall, 2003.
3. B. Jacob and D. Wang, "Memory Systems Architecture and Performance Analysis," Univ. of Maryland Eng. and Computer Eng. Dept. lecture; lecturesLecture15.pdf.
4. A.F. Benner et al., "Exploitation of Optical Interconnects in Future Server Architectures," IBM J. Research &Development, vol. 49, no. 4/5, July/Sept. 2005, pp. 755-775.
5. A.L. Glebov et al., "Optical Interconnect Modules with Fully Integrated Reflector Mirrors," IEEE Photonics Technology Letters, vol. 17, no. 7, July 2005, pp. 1540-1542.
6. D.M. Chiarulli et al., "Optoelectronic Buses for High Performance Computing," Proc. IEEE, vol. 92, no. 11, Nov. 1994, pp. 1701-1709.
7. K. Itoh et al., "Data Transmission Performance of an Optical Backboard Bus," Proc. 18th Int'l Electronic Manufacturing Technology Symp., IEEE Press, 1995, pp. 268-271.
8. H. Han et al., "An Optical Centralized Shared-Bus Architecture Demonstrator for Microprocessor-to-Memory Interconnects," IEEE J. Selected Topics in Quantum Electronics, vol. 9, no. 2, Mar./Apr. 2003, pp. 512-517.
9. A.L. Glebov, M.G. Lee, and K. Yokouchi, "Integration Technologies for Pluggable Backplane Optical Interconnects," Optical Eng., vol. 46, no. 1, Jan. 2007, 015403; Fujitsu_Optical_01-07.pdf.
10. L. Schares et al., "Terabus: Terabit/Second-Class Card-Level Optical Interconnect Technologies," IEEE J. Selected Topics in Quantum Electronics, vol. 12, no. 5, Sept./Oct. 2006, pp. 1032-1044.
11. F.E. Schow et al., "300 Gb/s, 24-Channel Full-Duplex, 850-nm CMOS-Based Optical Transceivers," Proc. Optical Fiber Comm./Nat'l Fiber Optic Engineers Conf. (OFC/NFOEC), 2008, IEEE Press, pp. 1-3.
12. F.E. Doany et al., "Chip-to-Chip Board-level Optical Data Buses," Proc. Optical Fiber Comm./Nat'l Fiber Optic Engineers Conf. (OFC/NFOEC), 2008, IEEE Press, pp. 1-3.
13. E.A. Marcatili and R.A. Schmeltzer, "Hollow Metallic and Dielectric Waveguides for Long Distance Optical Transmission and Lasers," Bell System Technical J., vol. 43, 1964, pp. 1783-1809.
14. P. Kornilovich, "Optical Modes of Rectangular Hollow Metal Waveguides," Hewlett-Packard/AMS Internal Memo, Aug. 2007.
15. P. Debernardi et al., "Reliable Polarization Control of VCSELs through Monolithically Integrated Surface Gratings," IEEE J. Selected Topics in Quantum Electronics, vol. 11, no. 1, Jan./Feb. 2005, pp. 107-116.
16. C.J. Chang-Hasnain et al., "Dynamic, Polarization, and Transverse Mode Characteristics of Vertical Cavity Surface Emitting Lasers," IEEE J. Quantum Electronics, vol. 27, no. 6, June 1991, pp. 1402-1409.
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