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A High-Speed Optical Multidrop Bus for Computer Interconnections
July/August 2009 (vol. 29 no. 4)
pp. 62-73
Michael R.T. Tan, Hewlett-Packard
Paul Rosenberg, Hewlett-Packard
Jong-Souk Yeo, Hewlett-Packard
Moray McLaren, Hewlett-Packard
Sagi Mathai, Hewlett-Packard
Terry Morris, Hewlett-Packard
Huei Pei Kuo, Hewlett-Packard
Joseph Straznicky, Hewlett-Packard
Norman P. Jouppi, Hewlett-Packard
Shih-Yuan Wang, Hewlett-Packard

Signal integrity constraints of high-speed electronics have made multidrop electrical buses infeasible. This high-speed alternative uses hollow metal waveguides and pellicle beam splitters that interconnect modules attached to the bus. With 1 mW of laser power, the bus can interconnect eight modules at 10 Gbps per channel and achieves an aggregate bandwidth of more than 25 Gbytes per second with 10-bit-wide signaling paths.

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Index Terms:
I/O and data communications, buses, multicast, optical interconnects, interprocessor communications, interconnection architectures, fiber optics, memory wall, hardware
Citation:
Michael R.T. Tan, Paul Rosenberg, Jong-Souk Yeo, Moray McLaren, Sagi Mathai, Terry Morris, Huei Pei Kuo, Joseph Straznicky, Norman P. Jouppi, Shih-Yuan Wang, "A High-Speed Optical Multidrop Bus for Computer Interconnections," IEEE Micro, vol. 29, no. 4, pp. 62-73, July-Aug. 2009, doi:10.1109/MM.2009.57
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