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| John Feehrer, Paul Rotker, Milton Shih, Paul Gingras, Peter Yakutis, Stephen Phillips, John Heath, "Coherency Hub Design for Multisocket Sun Servers with CoolThreads Technology," IEEE Micro, vol. 29, no. 4, pp. 36-47, July/August, 2009. | |||
| BibTex | x | ||
| @article{ 10.1109/MM.2009.62, author = {John Feehrer and Paul Rotker and Milton Shih and Paul Gingras and Peter Yakutis and Stephen Phillips and John Heath}, title = {Coherency Hub Design for Multisocket Sun Servers with CoolThreads Technology}, journal ={IEEE Micro}, volume = {29}, number = {4}, issn = {0272-1732}, year = {2009}, pages = {36-47}, doi = {http://doi.ieeecomputersociety.org/10.1109/MM.2009.62}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, } | |||
| RefWorks Procite/RefMan/Endnote | x | ||
| TY - MGZN JO - IEEE Micro TI - Coherency Hub Design for Multisocket Sun Servers with CoolThreads Technology IS - 4 SN - 0272-1732 SP36 EP47 EPD - 36-47 A1 - John Feehrer, A1 - Paul Rotker, A1 - Milton Shih, A1 - Paul Gingras, A1 - Peter Yakutis, A1 - Stephen Phillips, A1 - John Heath, PY - 2009 KW - chip multithreading KW - UltraSparc KW - cache coherency KW - multiprocessor interconnect KW - SpecCPU2006 KW - SPEC KW - AppServer2004 KW - hardware VL - 29 JA - IEEE Micro ER - | |||
CoHub, a coherency hub ASIC, provides a cost-effective way to extend a glueless two-node chip-multithreading system to a four-node system without changes to the processor. The four-node, 256-thread system achieves near-linear scaling of performance with thread count on transaction-processing workloads. Time-to-market pressure, 800-MHz operation, and a six-stage pipeline were among the constraints that shaped CoHub's design.
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2. J. Feehrer et al., "Coherency Hub Design for Multi-Node Victoria Falls Systems," Hot Interconnects 16, 2008; http://www.hoti.org/archive/2008papers2008_S2_1.pdf .
3. J.L. Hennessy and D.A. Patterson Computer Architecture: A Quantitative Approach, 4th ed., Morgan Kaufmann, 2007.
4. "UltraSPARC IV Processor Architecture Overview," white paper, Sun Microsystems, Feb. 2004; http://www.sun.com/processors/whitepapers us4_whitepaper.pdf.
5. "Low Pin Count Interface Specification," Intel, Aug. 2002; http://www.intel.com/design/chipsets/industry 25128901.pdf.
6. , "FB-DIMM Draft Specification: Architecture and Protocol," JEDEC Standard Proposal, JEDEC Solid Sate Technology Assoc., Mar. 2005.

