|
| This Article | ||
| ||
| Share | ||
| Bibliographic References | ||
| Add to: | ||
| | ||
| Search | ||
| ||
| ASCII Text | x | ||
| Xiaoyao Liang, Gu-Yeon Wei, David Brooks, "Revival: A Variation-Tolerant Architecture Using Voltage Interpolation and Variable Latency," IEEE Micro, vol. 29, no. 1, pp. 127-138, January/February, 2009. | |||
| BibTex | x | ||
| @article{ 10.1109/MM.2009.13, author = {Xiaoyao Liang and Gu-Yeon Wei and David Brooks}, title = {Revival: A Variation-Tolerant Architecture Using Voltage Interpolation and Variable Latency}, journal ={IEEE Micro}, volume = {29}, number = {1}, issn = {0272-1732}, year = {2009}, pages = {127-138}, doi = {http://doi.ieeecomputersociety.org/10.1109/MM.2009.13}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, } | |||
| RefWorks Procite/RefMan/Endnote | x | ||
| TY - MGZN JO - IEEE Micro TI - Revival: A Variation-Tolerant Architecture Using Voltage Interpolation and Variable Latency IS - 1 SN - 0272-1732 SP127 EP138 EPD - 127-138 A1 - Xiaoyao Liang, A1 - Gu-Yeon Wei, A1 - David Brooks, PY - 2009 KW - process variations KW - voltage interpolation KW - variable latency VL - 29 JA - IEEE Micro ER - | |||
Process variations will significantly degrade the performance benefits of future microprocessors as they move toward nanoscale technology. Device parameter fluctuations can introduce large variations in peak operation among chips, cores on a single chip, and microarchitectural blocks within one core. The Revival technique combines the post-fabrication tuning techniques voltage interpolation (VI) and variable latency (VL) to reduce such frequency variations.
11. K. Bowman, S. Duvall, and J. Meindl, "Impact of Die-to-Die and Within-Die Parameter Fluctuations on the Maximum Clock Frequency Distribution for Gigascale Integration," J. Solid-State Circuits, vol. 37, no. 2, Feb. 2002, pp. 183-190.
12. X. Liang and D. Brooks, "Mitigating the Impact of Process Variations on Processor Register Files and Execution Units," Proc. 39th IEEE Int'l Symp. Microarchitecture (Micro 06), IEEE CS Press, 2006, pp. 504-514.
13. S. Ozdemir et al., "Yield-Aware Cache Architectures," Proc. 39th IEEE/ACM Int'l Symp. Microarchitecture (Micro 06), IEEE CS Press, 2006, pp. 15-25.
14. A. Tiwari, S.R. Sarangi, and J. Torrellas, "Recycle: Pipeline Adaptation to Tolerate Process Variation," Proc. Int'l Symp. Computer Architecture (ISCA 07), ACM Press, 2007, pp. 323-334.
15. R. Teodorescu et al., "Mitigating Parameter Variation with Dynamic Fine-Grain Body Biasing," Proc. 40th IEEE Int'l Symp. Microarchitecture (Micro 07), IEEE CS Press, 2007, pp. 27-42.
16. X. Liang, D. Brooks, and G.-Y. Wei, "A Process-Variation-Tolerant Floating-Point Unit with Voltage Interpolation and Variable Latency," Proc. IEEE Int'l Solid-State Circuits Conf., IEEE Press, 2008, pp. 404-405.
17. E. Borch et al., "Loose Loops Sink Chips," Proc. 8th Int'l Symp. High-Performance Computer Architecture (HPCA 02), IEEE CS Press, 2002, pp. 299-310.
18. A.J. Bhavnagarwala, X. Tang, and J.D. Meindl, "The Impact of Intrinsic Device Fluctuations on CMOS SRAM Cell Stability," IEEE J. Solid-State Circuits, vol. 36, no. 4, Apr. 2001, pp. 658-665.
19. A. Agarwal et al., "A Process-Tolerant Cache Architecture for Improved Yield in Nanoscale Technologies," IEEE Trans. Very Large Scale Integration Systems, vol. 13, no. 1, Jan. 2005, pp. 27-38.
110. X. Liang, G. Wei, and D. Brooks, "Process Variation Tolerant 3T1D-based Cache Architectures," Proc. 40th IEEE Int'l Symp. Microarchitecture (Micro 07), IEEE CS Press, 2007, pp. 15-26.

