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| Kevin Reick, Pia N. Sanda, Scott Swaney, Jeffrey W. Kellington, Michael Mack, Michael Floyd, Daniel Henderson, "Fault-Tolerant Design of the IBM Power6 Microprocessor," IEEE Micro, vol. 28, no. 2, pp. 30-38, March/April, 2008. | |||
| BibTex | x | ||
| @article{ 10.1109/MM.2008.22, author = {Kevin Reick and Pia N. Sanda and Scott Swaney and Jeffrey W. Kellington and Michael Mack and Michael Floyd and Daniel Henderson}, title = {Fault-Tolerant Design of the IBM Power6 Microprocessor}, journal ={IEEE Micro}, volume = {28}, number = {2}, issn = {0272-1732}, year = {2008}, pages = {30-38}, doi = {http://doi.ieeecomputersociety.org/10.1109/MM.2008.22}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, } | |||
| RefWorks Procite/RefMan/Endnote | x | ||
| TY - MGZN JO - IEEE Micro TI - Fault-Tolerant Design of the IBM Power6 Microprocessor IS - 2 SN - 0272-1732 SP30 EP38 EPD - 30-38 A1 - Kevin Reick, A1 - Pia N. Sanda, A1 - Scott Swaney, A1 - Jeffrey W. Kellington, A1 - Michael Mack, A1 - Michael Floyd, A1 - Daniel Henderson, PY - 2008 KW - Hot Chips 19 KW - RAS KW - fault tolerance KW - fault isolation KW - reliability KW - instruction retry VL - 28 JA - IEEE Micro ER - | |||
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