Issue No.03 - May/June (2007 vol.27)
Gabriel H. Loh , Georgia Institute of Technology
Bryan Black , Intel
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MM.2007.59
Three-dimensional die-stacking integration stacks multiple layers of processed silicon with a very high-density, low-latency layer-to-layer interconnect. After presenting a brief background on 3D die-stacking technology, this article gives multiple case studies on different approaches for implementing single-core and multicore 3D processors and discusses how to design future microprocessors given this emerging technology.
processor architectures, computer systems organization, 3D integration
Gabriel H. Loh, Bryan Black, "Processor Design in 3D Die-Stacking Technologies", IEEE Micro, vol.27, no. 3, pp. 31-48, May/June 2007, doi:10.1109/MM.2007.59