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AsAP: A Fine-Grained Many-Core Platform for DSP Applications
March/April 2007 (vol. 27 no. 2)
pp. 34-45
Bevan Baas, University of California, Davis
Zhiyi Yu, University of California, Davis
Michael Meeuwsen, University of California, Davis
Omar Sattari, University of California, Davis
Ryan Apperson, University of California, Davis
Eric Work, University of California, Davis
Jeremy Webb, University of California, Davis
Michael Lai, University of California, Davis
Tinoosh Mohsenin, University of California, Davis
Dean Truong, University of California, Davis
Jason Cheung, University of California, Davis
Many emerging and future applications require significant levels of complex digital signal processing and operate within limited power budgets. Moreover, dramatically rising VLSI fabrication and design costs make programmable and reconfigurable solutions increasingly attractive. The AsAP project addresses these challenges with a chip multiprocessor composed of simple processors with small memories, achieving high energy efficiency and throughput in a small chip area.
Index Terms:
microarchitecture, multiprocessors, MIMD processors, embedded systems, special-purpose and application-based systems, digital signal processing, GALS networking
Citation:
Bevan Baas, Zhiyi Yu, Michael Meeuwsen, Omar Sattari, Ryan Apperson, Eric Work, Jeremy Webb, Michael Lai, Tinoosh Mohsenin, Dean Truong, Jason Cheung, "AsAP: A Fine-Grained Many-Core Platform for DSP Applications," IEEE Micro, vol. 27, no. 2, pp. 34-45, March-April 2007, doi:10.1109/MM.2007.29
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