Issue No.04 - July/August (2006 vol.26)
Sudhanva Gurumurthi , University of Virginia
Youngjae Kim , Pennsylvania State University
Anand Sivasubramaniam , Pennsylvania State University
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MM.2006.84
As demands for higher data transfer rates mount, temperature is joining bandwidth and latency as a key consideration in storage system design. The STEAM simulator lets users abstract the details of low-level recording physics and heat transfer phenomena and facilitates exploration of a large design space of storage configurations under realistic workloads.
STEAM, thermal simulation, storage systems design, heat transfer, data transfers
Sudhanva Gurumurthi, Youngjae Kim, Anand Sivasubramaniam, "Using STEAM for Thermal Simulation of Storage Systems", IEEE Micro, vol.26, no. 4, pp. 43-51, July/August 2006, doi:10.1109/MM.2006.84