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Using STEAM for Thermal Simulation of Storage Systems
July/August 2006 (vol. 26 no. 4)
pp. 43-51
Sudhanva Gurumurthi, University of Virginia
Youngjae Kim, Pennsylvania State University
Anand Sivasubramaniam, Pennsylvania State University
As demands for higher data transfer rates mount, temperature is joining bandwidth and latency as a key consideration in storage system design. The STEAM simulator lets users abstract the details of low-level recording physics and heat transfer phenomena and facilitates exploration of a large design space of storage configurations under realistic workloads.
Index Terms:
STEAM, thermal simulation, storage systems design, heat transfer, data transfers
Citation:
Sudhanva Gurumurthi, Youngjae Kim, Anand Sivasubramaniam, "Using STEAM for Thermal Simulation of Storage Systems," IEEE Micro, vol. 26, no. 4, pp. 43-51, July-Aug. 2006, doi:10.1109/MM.2006.84
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