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Temperature-Aware Computer Systems: Opportunities and Challenges
November/December 2003 (vol. 23 no. 6)
pp. 52-61
Kevin Skadron, University of Virginia
Mircea R. Stan, University of Virginia
Wei Huang, University of Virginia
Sivakumar Velusamy, University of Virginia
Karthik Sankaranarayanan, University of Virginia
David Tarjan, University of Virginia

Temperature-aware design techniques have an important role to play in addition to traditional techniques like power-aware design and package- and board-level thermal engineering. These authors define the role of architecture techniques and describe HotSpot, an accurate yet fast thermal model suitable for computer architecture research.

Citation:
Kevin Skadron, Mircea R. Stan, Wei Huang, Sivakumar Velusamy, Karthik Sankaranarayanan, David Tarjan, "Temperature-Aware Computer Systems: Opportunities and Challenges," IEEE Micro, vol. 23, no. 6, pp. 52-61, Nov.-Dec. 2003, doi:10.1109/MM.2003.1261387
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