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Chip-Package Codesign for High-Frequency Circuits and Systems
July/August 1998 (vol. 18 no. 4)
pp. 24-32
The demand of processing and transmitting fast-expanding information in the shortest time frame is driving the electronic components in computer and communication systems into "High Frequency" realm. In the meantime, the demand of light-weight, compact, and low-cost consumer electronics is driving the integrated circuits and systems to be smaller and cheaper. When these two trends merge together, the designers are facing a challenge: How to ensure the electronic components are functioning correctly in a smaller-than-ever environment with all the possible high-frequency parasitic effect? Chip-package co-design therefore becomes a focus in the hope of solving this issue.
Index Terms:
high frequency, integrated circuits, chip-package co-design, electronic packaging.
Citation:
Jenshan Lin, "Chip-Package Codesign for High-Frequency Circuits and Systems," IEEE Micro, vol. 18, no. 4, pp. 24-32, July-Aug. 1998, doi:10.1109/40.710868
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