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Microvias: The Next Generation of Substrates and Packages
July/August 1998 (vol. 18 no. 4)
pp. 10-16
The silicon revolution continues its rapid advances. New functionality in silicon, more I/Os per components and shrinking discreet components sizes are providing the opportunity for rapid product enhancements. Area array packages and now the new chip-size packages are creating a demand for higher and higher PCB density. The PCB has been the venerable cost-effective packaging solution of choice.
Index Terms:
PCB packaging, PCM density, array packages, chip-size packaging
Citation:
Happy Holden, "Microvias: The Next Generation of Substrates and Packages," IEEE Micro, vol. 18, no. 4, pp. 10-16, July-Aug. 1998, doi:10.1109/40.710866
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