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Interaction of Multichip Module Substrates with High-Density Connectors
March/April 1993 (vol. 13 no. 2)
pp. 36-44

The stresses and strains in substrate-connector systems in multichip modules (MCMs) are discussed. Simultaneous stresses were applied as structural loads in combined stress models. Modeling results show that definite relations exist between connector pitch, length, substrate thickness and material, and stresses in a connector body.

Citation:
Yakov Belopolsky, "Interaction of Multichip Module Substrates with High-Density Connectors," IEEE Micro, vol. 13, no. 2, pp. 36-44, March-April 1993, doi:10.1109/40.207087
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