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Trends in Low-Cost, High-Performance Substrate Technology
March/April 1993 (vol. 13 no. 2)
pp. 19-27

The trends in high density interconnection (HDI) multichip module (MCM) techniques that have the potential to reduce interconnection cost and production time are described. The implementation in laminated dielectric (MCM-L) technology of a workstation processor core illustrates current substrate technology capabilities. The design, routing, layout and thermal management of the processor core are described. Thin-film deposited dielectric (MCM-D) technology is discussed as a cost-effective method for future interconnection applications.

Citation:
David H. Carey, "Trends in Low-Cost, High-Performance Substrate Technology," IEEE Micro, vol. 13, no. 2, pp. 19-27, March-April 1993, doi:10.1109/40.207085
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