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Addressing the Challenges of Advanced Packaging and Interconnection
March/April 1993 (vol. 13 no. 2)
pp. 10-18

The author contends that packaging and interconnection technology is undergoing significant changes to meet the rapidly evolving requirements of portable electronics products. The need for high density and high performance at low cost demands sophisticated developments in technology. Future portable equipment packaging requirements can be met only through advanced concepts, including multichip modules, tape-automated bonding, and flip-chip assembly. Supporting technologies, such as adhesive assembly, thermal management, and design tools must also make attendant advances. Consortium-based cooperative research and development of technologies addresses these needs, while also developing the essential vendor infrastructure.

Citation:
Dennis J. Herrell, "Addressing the Challenges of Advanced Packaging and Interconnection," IEEE Micro, vol. 13, no. 2, pp. 10-18, March-April 1993, doi:10.1109/40.207084
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