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OpenDFM Bridging the Gap Between DRC and DFM
Dec. 2012 (vol. 29 no. 6)
pp. 84-90
Jake Buurma, Engineering Department, Si2, Austin,
Cathy Rodgers, Synopsys,
Editor's note:
Index Terms:
Semiconductor device manufacture,Semiconductor device packaging,System-on-a-chip,Schedules,Economics,Manufacturing,OpenDFM,EDA Standards,Semiconductor Manufacturability,
Citation:
Jake Buurma, Cathy Rodgers, Fred Valente, Robert Sayah, "OpenDFM Bridging the Gap Between DRC and DFM," IEEE Design & Test of Computers, vol. 29, no. 6, pp. 84-90, Dec. 2012, doi:10.1109/MDT.2012.2210380
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