|
| This Article | ||
| ||
| Share | ||
| Bibliographic References | ||
| Add to: | ||
 Digg  Furl  Spurl  Blink  Simpy  Google  Del.icio.us  Y!MyWeb | ||
| Search | ||
| ||
OpenDFM Bridging the Gap Between DRC and DFM
Dec. 2012 (vol. 29 no. 6)
pp. 84-90
| ASCII Text | x | ||
| Jake Buurma, Cathy Rodgers, Fred Valente, Robert Sayah, "OpenDFM Bridging the Gap Between DRC and DFM," IEEE Design & Test of Computers, vol. 29, no. 6, pp. 84-90, Dec., 2012. | |||
| BibTex | x | ||
| @article{ 10.1109/MDT.2012.2210380, author = {Jake Buurma and Cathy Rodgers and Fred Valente and Robert Sayah}, title = {OpenDFM Bridging the Gap Between DRC and DFM}, journal ={IEEE Design & Test of Computers}, volume = {29}, number = {6}, issn = {0740-7475}, year = {2012}, pages = {84-90}, doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2012.2210380}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, } | |||
| RefWorks Procite/RefMan/Endnote | x | ||
| TY - MGZN JO - IEEE Design & Test of Computers TI - OpenDFM Bridging the Gap Between DRC and DFM IS - 6 SN - 0740-7475 SP84 EP90 EPD - 84-90 A1 - Jake Buurma, A1 - Cathy Rodgers, A1 - Fred Valente, A1 - Robert Sayah, PY - 2012 KW - Semiconductor device manufacture KW - Semiconductor device packaging KW - System-on-a-chip KW - Schedules KW - Economics KW - Manufacturing KW - OpenDFM KW - EDA Standards KW - Semiconductor Manufacturability KW - VL - 29 JA - IEEE Design & Test of Computers ER - | |||
Editor's note:
Index Terms:
Semiconductor device manufacture,Semiconductor device packaging,System-on-a-chip,Schedules,Economics,Manufacturing,OpenDFM,EDA Standards,Semiconductor Manufacturability,
Citation:
Jake Buurma, Cathy Rodgers, Fred Valente, Robert Sayah, "OpenDFM Bridging the Gap Between DRC and DFM," IEEE Design & Test of Computers, vol. 29, no. 6, pp. 84-90, Dec. 2012, doi:10.1109/MDT.2012.2210380
Usage of this product signifies your acceptance of the Terms of Use.