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Long-Term Thermal Overstressing of Computers
Nov.-Dec. 2011 (vol. 28 no. 6)
pp. 58-65
Kirk A. Gray, Accelerated Reliability Solutions
Michael Pecht, University of Maryland, College Park

Significant opportunities exist to reduce costs in the design, manufacture, and operation of systems by using temperatures higher than specified in testing systems' reliability. The authors share the findings and observations of an experimental study in which they subjected operating computers to high steady-state temperatures and thermal cycling well beyond their design specifications. The results suggest that significant cost savings can be realized without compromising reliability.

1. US Dept. of Defense, Mil-Hdbk-217: Military Handbook for Reliability Prediction of Electronic Equipment, version A, 1965.
2. J. Kopanski et al., "Assessment of Reliability Concerns for Wide-Temperature Operation of Semiconductor Device Circuits," Trans. First Int'l High Temperature Electronics Conf., Int'l Microelectronics and Packaging Soc. (IMAPS), 1991, pp. 137-142.
3. M.J. Cushing, "U.S. Army Reliability Standardization Improvement Policy and Its Impact," IEEE Trans. Components, Packaging, and Manufacturing Technology, vol. 19, no. 2, 1996, pp. 277-278.
4. M.G. Pecht and F.R. Nash, "Predicting the Reliability of Electronic Equipment," Proc. IEEE, July 1994, pp. 992-1004.
5. M.G. Pecht, "Issues Affecting Early Affordable Access to Leading Electronics Technologies by the US Military and Government," Circuit World, vol. 22, no. 2, 1996, pp. 7-15.
6. M.J. Cushing et al., "Comparison of Electronics-Reliability Assessment Approaches," IEEE Trans. Reliability, vol. 42, no. 4, 1993, pp. 542-546.
7. S.P. Park, K. Kang, and K. Roy, "Reliability Implications of Bias-Temperature Instability in Digital ICs," IEEE Design and Test, vol. 26, no. 6, 2009, pp. 8-17.
8. J.M. Carulli Jr. and T.J. Anderson, "The Impact of Multiple Failure Modes on Estimating Product Field Reliability," IEEE Design and Test, vol. 23, no. 2, 2006, pp. 118-126.
9. C.T. Leonard, "Mechanical Engineering Issues and Electronic Equipment Reliability: Incurred Costs without Compensating Benefits," IEEE Trans. Components, Hybrids, and Manufacturing Technology, vol. 13, no. 4, 1990, pp. 895-902.
10. E. Pinheiro, W. Weber, and L.A. Barroso, "Failure Trends in a Large Disk Drive Population," Proc. 5th Usenix Conf. File and Storage Technologies (FAST 07), Usenix Assoc., 2007, pp. 17-28.
11. H. Qi, S. Ganesan, and M. Pecht, "No-Fault-Found and Intermittent Failures in Electronic Products," Microelectronics Reliability, vol. 48, no. 5, 2008, pp. 663-674.

Index Terms:
design and test, long-term thermal overstressing, computer, reliability, high temperature, cost savings
Citation:
Kirk A. Gray, Michael Pecht, "Long-Term Thermal Overstressing of Computers," IEEE Design & Test of Computers, vol. 28, no. 6, pp. 58-65, Nov.-Dec. 2011, doi:10.1109/MDT.2011.127
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