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The Future of Signoff
May/June 2011 (vol. 28 no. 3)
pp. 86-89
Andrew B. Kahng, University of California, San Diego

This column examines the challenges inherent in the signoff stage of the design cycle just prior to fabrication. Modeling trends, as well as trends from the designer side, and their possible effects on signoff are identified.

Index Terms:
design and test, physical design, signoff
Citation:
Andrew B. Kahng, "The Future of Signoff," IEEE Design & Test of Computers, vol. 28, no. 3, pp. 86-89, May-June 2011, doi:10.1109/MDT.2011.66
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