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Issue No.03 - May/June (2011 vol.28)
pp: 86-89
Andrew B. Kahng , University of California, San Diego
ABSTRACT
<p>This column examines the challenges inherent in the signoff stage of the design cycle just prior to fabrication. Modeling trends, as well as trends from the designer side, and their possible effects on signoff are identified.</p>
INDEX TERMS
design and test, physical design, signoff
CITATION
Andrew B. Kahng, "The Future of Signoff", IEEE Design & Test of Computers, vol.28, no. 3, pp. 86-89, May/June 2011, doi:10.1109/MDT.2011.66
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