Issue No.06 - November/December (2010 vol.27)
Published by the IEEE Computer Society
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2010.129
IEEE Design and Test Conference reports
European Test Symposium 2010
The 15th IEEE European Test Symposium, which received 155 submissions from 32 countries, took place 24-28 May in Prague, Czech Republic, and attracted more than 180 test professionals from 27 countries. Keynote speakers Michael Campbell (Qualcomm CDMA Technologies) addressed the impact of product complexity on test and Abhijit Chatterjee (Georgia Tech) described future self-aware wireless communication and signal processing systems. Program highlights included embedded tutorials, panel discussions, and a Test Spring School for PhD students. For a full report, visit http://www.computer.org/dt/conf_reports.
—Ondrej Nov (Technical University of Liberec) and Sybille Hellebrand (University of Paderborn)
International On-Line Test Symposium
The 16th IEEE International On-Line Test Symposium, held 5-7 June, featured a panel focused on soft-error rates and standards. SER per chip is predicted to increase 7× when the industry moves from 130-nm to 22-nm technology, highlighting the importance of SER measurement standards. The panel discussed new technical discoveries and agreed that JEDEC should be asked to form a task group to address updating JESD89. Areas covered included lower-energy particles; soft error cross-section; devices other than SRAM and DRAM; thermal neutrons; multimode effects; and alpha SER. For a full report, visit http://www.computer.org/dt/panel_summaries.
—Charles Slayman (Ops A La Carte)