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Chips in 3D (HTML)
July/August 2010 (vol. 27 no. 4)
pp. 68-69
Igor Markov, University of Michigan

This is a review of Three-Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures (by Yuan Xie, Jason Cong, and Sachin Sapatnekar, eds.).

Index Terms:
3D integration, circuit design, computer architecture, design and test, EDA, VLSI
Citation:
Igor Markov, "Chips in 3D," IEEE Design & Test of Computers, vol. 27, no. 4, pp. 68-69, July-Aug. 2010, doi:10.1109/MDT.2010.81
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