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Carbon Nanomaterials: The Ideal Interconnect Technology for Next-Generation ICs
July/August 2010 (vol. 27 no. 4)
pp. 20-31
Hong Li, University of California, Santa Barbara
Chuan Xu, University of California, Santa Barbara
Kaustav Banerjee, University of California, Santa Barbara

Editor's note:

Carbon nanotubes and graphene nanoribbons are two promising next-generation interconnect technologies. Electrical modeling and performance analysis have demonstrated the superiority of these emerging technologies compared to conventional copper interconnects, as this article explains.

—Sriram Vangal, Intel

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Index Terms:
design and test, carbon nanomaterials, carbon nanotube (CNT), graphene nanoribbon (GNR), electrical interconnects, optical interconnects, RF or wireless interconnects, on-chip vias, through-silicon vias (TSVs), delay, power
Citation:
Hong Li, Chuan Xu, Kaustav Banerjee, "Carbon Nanomaterials: The Ideal Interconnect Technology for Next-Generation ICs," IEEE Design & Test of Computers, vol. 27, no. 4, pp. 20-31, July-Aug. 2010, doi:10.1109/MDT.2010.55
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