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Partha Pratim Pande, Washington State University

This special issue highlights recent investigations of various revolutionary interconnect paradigms as to whether they can deliver on the promise of greater integration, high performance, good scalability, and high energy efficiency in future SoCs and other computing platforms. The selected articles represent a wide range of emerging interconnects, from carbon nanotubes, to optical, RF, and on-chip wireless communications.

Index Terms:
design and test, carbon nanotubes, conventional metal interconnects, interconnect technology, interconnection architectures, on-chip communication, optical communication, wireless communications
Citation:
Partha Pratim Pande, Sriram Vangal, "Guest Editors' Introduction: Promises and Challenges of Novel Interconnect Technologies," IEEE Design & Test of Computers, vol. 27, no. 4, pp. 6-9, July-Aug. 2010, doi:10.1109/MDT.2010.87
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