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Issue No.05 - September/October (2009 vol.26)
pp: 64-73
W. Robert Daasch , Portland State University
C. Glenn Shirley , Portland State University
Amit Nahar , Texas Instruments
<p>Editor's note:</p><p>The quantity and complexity of data generated at each test manufacturing step can be daunting. This article, which emerged from a tutorial presented at ITC 2008, explains the application of statistics to help process that data and provides examples of how test has shifted from descriptive to predictive methods.</p><p align="right"><it>&#x2014;Nur A. Touba, University of Texas</it></p>
statistical test, design and test, statistical modeling, multisite testing, burn-in, outlier identification, outlier screening, data mining
W. Robert Daasch, C. Glenn Shirley, Amit Nahar, "Statistics in Semiconductor Test: Going beyond Yield", IEEE Design & Test of Computers, vol.26, no. 5, pp. 64-73, September/October 2009, doi:10.1109/MDT.2009.123
1. K. Butler et al., "Multi-dimensional Test Escape Rate Modeling," IEEE Design and Test, vol. 26, no. 5, 2009, pp. 74-82.
2. R.V. Hogg, A. Craig, and J.W. McKean, Introduction to Mathematical Statistics, 6th ed., Prentice Hall, 2005.
3. T. Hastie, R. Tibshriani, and J. Friedman, Elements of Statistical Learning: Data Mining, Inference, Prediction, 2nd ed., Springer, 2009.
4. N. Velamatti and W.R. Daasch, "Analytical Model for Multi-site Efficiency with Parallel to Serial Test Times, Yield and Clustering," Proc. 27th IEEE VLSI Test Symp. (VTS 09), IEEE CS Press, 2009, pp. 270-275.
5. C.H. Stapper, "Modeling of Integrated Circuit Defect Sensitivities," IBM J. Research and Development, Nov. 1983, pp. 549-557.
6. W.R. Daasch et al., "Neighborhood Selection for IDDQOutlier Screening," IEEE Design and Test, vol. 19, no. 5, 2002, pp. 74-81.
7. S. Sabade and D. Walker, "Use of Multiple IDDQ Test Metrics for Outlier Identification," Proc. 22nd IEEE VLSI Test Symp. (VTS 03), IEEE CS Press, 2003, pp. 31-38.
8. A. Nahar, R. Daasch, and S. Subramaniam, "Burn-in Reduction Using Principal Component Analysis," Proc. IEEE Int'l Test Conf. (ITC 05), IEEE CS Press, 2005, pp. 155-164.
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