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| Philip Emma, Eren Kursun, "Opportunities and Challenges for 3D Systems and Their Design," IEEE Design & Test of Computers, vol. 26, no. 5, pp. 6-14, September/October, 2009. | |||
| BibTex | x | ||
| @article{ 10.1109/MDT.2009.119, author = {Philip Emma and Eren Kursun}, title = {Opportunities and Challenges for 3D Systems and Their Design}, journal ={IEEE Design & Test of Computers}, volume = {26}, number = {5}, issn = {0740-7475}, year = {2009}, pages = {6-14}, doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2009.119}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, } | |||
| RefWorks Procite/RefMan/Endnote | x | ||
| TY - MGZN JO - IEEE Design & Test of Computers TI - Opportunities and Challenges for 3D Systems and Their Design IS - 5 SN - 0740-7475 SP6 EP14 EPD - 6-14 A1 - Philip Emma, A1 - Eren Kursun, PY - 2009 KW - 3D systems VL - 26 JA - IEEE Design & Test of Computers ER - | |||
Editor's note:
This article presents the system design opportunities offered by 3D integration, and it discusses the design and test challenges for 3D ICs, with various new design-for-manufacture and DFT issues.
—Yuan Xie, Pennsylvania State University
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