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Issue No.04 - July-August (2008 vol.25)
pp: 372-381
Philip Y. Paik , ICx Biosystems
Vamsee K. Pamula , Advanced Liquid Logic
Krishnendu Chakrabarty , Duke University
ABSTRACT
Thermal management has emerged as an increasingly important aspect of IC design. Elevated die temperatures are detrimental to circuit performance and reliability. Furthermore, hot spots due to spatially nonuniform heat flux in ICs can cause physical stress that further reduces reliability. The authors of this article review various chip-cooling techniques that have been proposed in the literature. They then present an alternative approach based on a recently invented digital-microfluidic platform that enables an adaptive cooling technique. This novel digital-fluid-handling platform uses a phenomenon known as electrowetting so that a vast array of discrete droplets of liquid, ranging from microliters to nanoliters and potentially to picoliters, can be independently moved along a substrate. Although this technology was originally developed for a biological and chemical lab on a chip, the authors show how it can be adapted for use as a fully reconfigurable, adaptive cooling platform.
INDEX TERMS
chip cooling, fluid flow, heat removal, microfluidics, digital microfluidics, reconfigurability, adaptive cooling platform
CITATION
Philip Y. Paik, Vamsee K. Pamula, Krishnendu Chakrabarty, "A Digital-Microfluidic Approach to Chip Cooling", IEEE Design & Test of Computers, vol.25, no. 4, pp. 372-381, July-August 2008, doi:10.1109/MDT.2008.87
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