|
| This Article | ||
| ||
| Share | ||
| Bibliographic References | ||
| Add to: | ||
 Digg  Furl  Spurl  Blink  Simpy  Google  Del.icio.us  Y!MyWeb | ||
| Search | ||
| ||
| ASCII Text | x | ||
| Changwook Yoon, Junwoo Lee, Young-Jin Park, Hyunjeong Park, Jaemin Kim, Jun So Pak, Joungho Kim, "Design of a Low-Noise UWB Transceiver SiP," IEEE Design & Test of Computers, vol. 25, no. 1, pp. 18-28, January-February, 2008. | |||
| BibTex | x | ||
| @article{ 10.1109/MDT.2008.9, author = {Changwook Yoon and Junwoo Lee and Young-Jin Park and Hyunjeong Park and Jaemin Kim and Jun So Pak and Joungho Kim}, title = {Design of a Low-Noise UWB Transceiver SiP}, journal ={IEEE Design & Test of Computers}, volume = {25}, number = {1}, issn = {0740-7475}, year = {2008}, pages = {18-28}, doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2008.9}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, } | |||
| RefWorks Procite/RefMan/Endnote | x | ||
| TY - MGZN JO - IEEE Design & Test of Computers TI - Design of a Low-Noise UWB Transceiver SiP IS - 1 SN - 0740-7475 SP18 EP28 EPD - 18-28 A1 - Changwook Yoon, A1 - Junwoo Lee, A1 - Young-Jin Park, A1 - Hyunjeong Park, A1 - Jaemin Kim, A1 - Jun So Pak, A1 - Joungho Kim, PY - 2008 KW - UWB KW - SiP KW - transceiver KW - low noise KW - signal integrity KW - power integrity VL - 25 JA - IEEE Design & Test of Computers ER - | |||
1. Federal Communications Commission (FCC), Revision of Part 15 of the Commission's Rules Regarding Ultra-Wideband Transmission Systems, First Report and Order, ET Docket 98-153, FCC 02-48, 2002; http://www.fcc.gov/Bureaus/Engineering_Technology/ Orders/2002fcc02048.pdf.
2. R.R. Tummala, "SOP: What Is It and Why? A New Microsystem-Integration Technology Paradigm-Moore's Law for System Integration of Miniaturized Convergent Systems of the Next Decade," IEEE Trans. Advanced Packaging, vol. 27, no. 2, May 2004, pp. 241—249.
3. R.R. Tummala and V.K. Madisetti, "System on Chip or System on Package?," IEEE Design &Test, vol. 16, no. 2, Apr.—June 1999, pp. 48—56.
4. J. Lee et al., "System-on-Package Ultra-Wideband Transmitter Using CMOS Impulse Generator," IEEE Trans. Microwave Theory and Techniques, vol. 54, no. 4, part 2, 2006, pp. 1667—1674.
5. M. Kim et al., "System on Package Ultra Wideband Transmitter with Integrated Band-Pass Filter and Broad Band Planar Antenna," Proc. 55th Electronic Components and Technology Conf., IEEE Press, 2005, pp. 541—544.
6. C. Yoon et al., "Design of LTCC-Based Ultra-Wideband Transmitter SiP Using CMOS Impulse Generator," Proc. 8th Electronic Packaging Technology Conf. (EPTC 06), 2006, pp. 85—89.
7. S. Tiuraniemi et al., "Front-End Receiver for Low Power, Low Complexity Non-Coherent UWB Communications System," IEEE Int'l Conf. Ultra-Wideband (ICU 05), IEEE Press, 2005, pp. 339—343.
8. E. Bogatin, Signal Integrity-Simplified, Prentice Hall PTR, 2003.
9. D.G. Kam et al., "Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array," IEEE Design &Test, vol. 23, no. 3, May—June 2006, pp. 212—219.
10. J.S. Pak et al., "Modeling and Measurement of Radiated Field Emission from a Power/Ground Plane Cavity Edge Excited by a Through-Hole Signal Via Based on a Balanced TLM and Via Coupling Model," IEEE Trans. Advanced Packaging, vol. 30, no. 1, Feb. 2007, pp. 73—85.
11. J. Park et al., "Noise Coupling to Signal Trace and Via from Power/Ground Simultaneous Switching Noise in High Speed Double Data Rates Memory Module," Proc. Int'l Symp. Electromagnetic Compatibility (EMC 04), IEEE Press, vol. 2, 2004, pp. 592—597.
12. Y. Jeong et al., "Analysis of Noise Isolation Methods on Split Power/Ground Plane of Multi-Layered Package and PCB for Low Jitter Mixed Mode System," Electrical Performance of Electronic Packaging, IEEE Press, 2003, pp. 199—202.