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Power Grid Physics and Implications for CAD
May-June 2007 (vol. 24 no. 3)
pp. 246-254
Sanjay Pant, University of Michigan, Ann Arbor
Eli Chiprout, Intel
David Blaauw, University of Michigan, Ann Arbor
An accurate analysis of supply noise in power distribution networks is essential to ensure reliable performance in high-performance designs. Recently, several analysis and optimization techniques for on-chip power grid networks have been proposed. However, all of these approaches assume a particular simplified model or behavior of the complex power delivery network. This article describes the first detailed, full-die, dynamic model of an Intel Pentium IV microprocessor design. The authors justify this model from the ground up, starting with a full-wave model and then using increasingly larger, but less detailed models, with only the irrelevant elements removed at each step. Using these models, the authors show that there is little impact of on-die inductance in such a design, and that package-die cosimulation is critical to understanding the grid's resonant properties. The authors also show that transient supply noise is sensitive to the nonuniform decoupling-capacitor (decap) distribution and that supply drop locality is a tight function of frequency and package-die resonance. All of these points have an impact on the kind of analysis and optimization required from CAD.
Index Terms:
R, L(di/dt), decap, resonance, locality, power supply networks
Citation:
Sanjay Pant, Eli Chiprout, David Blaauw, "Power Grid Physics and Implications for CAD," IEEE Design & Test of Computers, vol. 24, no. 3, pp. 246-254, May-June 2007, doi:10.1109/MDT.2007.78
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