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Issue No.03 - May/June (vol.23)
ISSN: 0740-7475
TABLE OF CONTENTS
From the EIC
Kwang-Ting (Tim) Cheng , University of California, Santa Barbara
pp. 181
DAC Watch
Sachin Sapatnekar , University of Minnesota
Grant Martin , Tensilica
pp. 182-184
Conference Reports
Fabian Vargas , General Chair, LATW '06
pp. 185
System-in-Package Design and Test
Peter Rickert , Texas Instruments
pp. 188-195
Thomas Brandtner , Infineon Technologies
pp. 196-202
Paolo Bernardi , Politecnico di Torino
Davide Appello , STMicroelectronics
Matteo Sonza Reorda , Politecnico di Torino
pp. 203-211
Joungho Kim , Korea Advanced Institute of Science and Technology
Jiheon Yu , Amkor Technology Korea
Ho Choi , Amkor Technology Korea
Dong Gun Kam , Korea Advanced Institute of Science and Technology
Choonheung Lee , Amkor Technology Korea
pp. 212-219
Vijay K. Madisetti , Georgia Institute of Technology
pp. 220-233
Vincent Kerz?rho , Philips Semiconductors and LIRMM
Philippe Cauvet , Philips Semiconductors
pp. 234-243
Book Reviews
Departments
CEDA Currents (HTML)
pp. 252-253
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