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Issue No.03 - May/June (2006 vol.23)
pp: 256
T.M. Mak , Intel
ABSTRACT
With technology scaling, nature has not been kind to conventional analog circuit design. System in package seems the obvious way to go. But its predecessor was the multichip module, and basically, all the problems are still there. The author discusses where to go from here.
INDEX TERMS
System in Package, SiP, integration
CITATION
T.M. Mak, "Is System in Package the Panacea for Integration?", IEEE Design & Test of Computers, vol.23, no. 3, pp. 256, May/June 2006, doi:10.1109/MDT.2006.76
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