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Electronic System, Platform, and Package Codesign
May/June 2006 (vol. 23 no. 3)
pp. 220-233
Vijay K. Madisetti, Georgia Institute of Technology
Editor's note: Integrating multicore heterogeneous systems into a system-in-package has challenged many design and test engineers. To overcome these obstacles, we need a common EDA tool for digital, analog, RF, and thermal designs. This article proposes a platform-centric design methodology for modern electronic systems that could incorporate system-on-chip, system-inpackage, and system-on-package technologies.
Index Terms:
System-on-Chip, System-on-Package, System-in-Package, Platform-Based Design, System-Level Design Automation, Electronic Packaging
Citation:
Vijay K. Madisetti, "Electronic System, Platform, and Package Codesign," IEEE Design & Test of Computers, vol. 23, no. 3, pp. 220-233, May-June 2006, doi:10.1109/MDT.2006.67
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