Issue No.03 - May/June (2006 vol.23)
Peter Rickert , Texas Instruments
William Krenik , Texas Instruments
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2006.64
Editor's note: Engineers must make many cost-effective decisions during a product'sdesign cycle. One challenge is deciding on the best packaging for their products. This article presents trade-offs among system-in-package, system-on-chip, package-on-package and integration for mobile phone applications.
SiP, SoC, PiP, PoP, analog integration, RF integration, memory integration
Peter Rickert, William Krenik, "Cell Phone Integration: SiP, SoC, and PoP", IEEE Design & Test of Computers, vol.23, no. 3, pp. 188-195, May/June 2006, doi:10.1109/MDT.2006.64