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Cell Phone Integration: SiP, SoC, and PoP
May/June 2006 (vol. 23 no. 3)
pp. 188-195
Peter Rickert, Texas Instruments
William Krenik, Texas Instruments
Editor's note: Engineers must make many cost-effective decisions during a product'sdesign cycle. One challenge is deciding on the best packaging for their products. This article presents trade-offs among system-in-package, system-on-chip, package-on-package and integration for mobile phone applications.
Index Terms:
SiP, SoC, PiP, PoP, analog integration, RF integration, memory integration
Citation:
Peter Rickert, William Krenik, "Cell Phone Integration: SiP, SoC, and PoP," IEEE Design & Test of Computers, vol. 23, no. 3, pp. 188-195, May-June 2006, doi:10.1109/MDT.2006.64
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