|
| This Article | ||
| ||
| Share | ||
| Bibliographic References | ||
| Add to: | ||
 Digg  Furl  Spurl  Blink  Simpy  Google  Del.icio.us  Y!MyWeb | ||
| Search | ||
| ||
Cell Phone Integration: SiP, SoC, and PoP
May/June 2006 (vol. 23 no. 3)
pp. 188-195
| ASCII Text | x | ||
| Peter Rickert, William Krenik, "Cell Phone Integration: SiP, SoC, and PoP," IEEE Design & Test of Computers, vol. 23, no. 3, pp. 188-195, May/June, 2006. | |||
| BibTex | x | ||
| @article{ 10.1109/MDT.2006.64, author = {Peter Rickert and William Krenik}, title = {Cell Phone Integration: SiP, SoC, and PoP}, journal ={IEEE Design & Test of Computers}, volume = {23}, number = {3}, issn = {0740-7475}, year = {2006}, pages = {188-195}, doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2006.64}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, } | |||
| RefWorks Procite/RefMan/Endnote | x | ||
| TY - MGZN JO - IEEE Design & Test of Computers TI - Cell Phone Integration: SiP, SoC, and PoP IS - 3 SN - 0740-7475 SP188 EP195 EPD - 188-195 A1 - Peter Rickert, A1 - William Krenik, PY - 2006 KW - SiP KW - SoC KW - PiP KW - PoP KW - analog integration KW - RF integration KW - memory integration VL - 23 JA - IEEE Design & Test of Computers ER - | |||
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2006.64
Editor's note: Engineers must make many cost-effective decisions during a product'sdesign cycle. One challenge is deciding on the best packaging for their products. This article presents trade-offs among system-in-package, system-on-chip, package-on-package and integration for mobile phone applications.
Index Terms:
SiP, SoC, PiP, PoP, analog integration, RF integration, memory integration
Citation:
Peter Rickert, William Krenik, "Cell Phone Integration: SiP, SoC, and PoP," IEEE Design & Test of Computers, vol. 23, no. 3, pp. 188-195, May-June 2006, doi:10.1109/MDT.2006.64
Usage of this product signifies your acceptance of the Terms of Use.