Issue No.03 - May/June (2006 vol.23)
Kwang-Ting (Tim) Cheng , University of California, Santa Barbara
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2006.83
Although successful and profitable applications have proven themselves in several market segments, significant challenges in system-in-package design and test remain for broader adoption.
SiP, system in package
Kwang-Ting (Tim) Cheng, "The Need for a SiP Design and Test Infrastructure", IEEE Design & Test of Computers, vol.23, no. 3, pp. 181, May/June 2006, doi:10.1109/MDT.2006.83