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May/June 2006 (vol. 23 no. 3)
pp. 181
Kwang-Ting (Tim) Cheng, University of California, Santa Barbara
Although successful and profitable applications have proven themselves in several market segments, significant challenges in system-in-package design and test remain for broader adoption.
Index Terms:
SiP, system in package
Citation:
Kwang-Ting (Tim) Cheng, "The Need for a SiP Design and Test Infrastructure," IEEE Design & Test of Computers, vol. 23, no. 3, pp. 181, May-June 2006, doi:10.1109/MDT.2006.83
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