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Bridging the Processor-Memory Performance Gapwith 3D IC Technology
November/December 2005 (vol. 22 no. 6)
pp. 556-564
Christianto C. Liu, Cornell University
Ilya Ganusov, Cornell University
Martin Burtscher, Cornell University
Sandip Tiwari, Cornell University
Bringing the memory close to the processor is obviously a good idea forreducing latency, but the memory is not a monolith: It includes submodules, and their arrangement determines the effectiveness of using 3D technology. The authors look at various scenarios for arranging the CPU relative to the memory modules and provide a quantitative comparison.
Index Terms:
three-dimensional integration 3-D ICs microprocessor cache design stream prefetching embedded DRAM
Citation:
Christianto C. Liu, Ilya Ganusov, Martin Burtscher, Sandip Tiwari, "Bridging the Processor-Memory Performance Gapwith 3D IC Technology," IEEE Design & Test of Computers, vol. 22, no. 6, pp. 556-564, Nov.-Dec. 2005, doi:10.1109/MDT.2005.134
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