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Issue No.06 - November/December (2005 vol.22)
pp: 556-564
Christianto C. Liu , Cornell University
Ilya Ganusov , Cornell University
Martin Burtscher , Cornell University
Sandip Tiwari , Cornell University
ABSTRACT
Bringing the memory close to the processor is obviously a good idea forreducing latency, but the memory is not a monolith: It includes submodules, and their arrangement determines the effectiveness of using 3D technology. The authors look at various scenarios for arranging the CPU relative to the memory modules and provide a quantitative comparison.
INDEX TERMS
three-dimensional integration 3-D ICs microprocessor cache design stream prefetching embedded DRAM
CITATION
Christianto C. Liu, Ilya Ganusov, Martin Burtscher, Sandip Tiwari, "Bridging the Processor-Memory Performance Gapwith 3D IC Technology", IEEE Design & Test of Computers, vol.22, no. 6, pp. 556-564, November/December 2005, doi:10.1109/MDT.2005.134
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