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Physical Design for 3D System on Package
November/December 2005 (vol. 22 no. 6)
pp. 532-539
| ASCII Text | x | ||
| Sung Kyu Lim, "Physical Design for 3D System on Package," IEEE Design & Test of Computers, vol. 22, no. 6, pp. 532-539, November/December, 2005. | |||
| BibTex | x | ||
| @article{ 10.1109/MDT.2005.149, author = {Sung Kyu Lim}, title = {Physical Design for 3D System on Package}, journal ={IEEE Design & Test of Computers}, volume = {22}, number = {6}, issn = {0740-7475}, year = {2005}, pages = {532-539}, doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2005.149}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, } | |||
| RefWorks Procite/RefMan/Endnote | x | ||
| TY - MGZN JO - IEEE Design & Test of Computers TI - Physical Design for 3D System on Package IS - 6 SN - 0740-7475 SP532 EP539 EPD - 532-539 A1 - Sung Kyu Lim, PY - 2005 KW - 3D packaging KW - System-On-Package KW - placement and routing KW - thermal distribution KW - decoupling capacitors KW - crosstalk VL - 22 JA - IEEE Design & Test of Computers ER - | |||
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2005.149
Systems on package constitute a specific class of 3D designs wherein multiple manufactured die are stacked atop one another in a package that embeds both active and passive components. This article considers the problem of physical design for such an environment.
Index Terms:
3D packaging, System-On-Package, placement and routing, thermal distribution, decoupling capacitors, crosstalk
Citation:
Sung Kyu Lim, "Physical Design for 3D System on Package," IEEE Design & Test of Computers, vol. 22, no. 6, pp. 532-539, Nov.-Dec. 2005, doi:10.1109/MDT.2005.149
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