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Physical Design for 3D System on Package
November/December 2005 (vol. 22 no. 6)
pp. 532-539
Sung Kyu Lim, Georgia Institute of Technology
Systems on package constitute a specific class of 3D designs wherein multiple manufactured die are stacked atop one another in a package that embeds both active and passive components. This article considers the problem of physical design for such an environment.
Index Terms:
3D packaging, System-On-Package, placement and routing, thermal distribution, decoupling capacitors, crosstalk
Citation:
Sung Kyu Lim, "Physical Design for 3D System on Package," IEEE Design & Test of Computers, vol. 22, no. 6, pp. 532-539, Nov.-Dec. 2005, doi:10.1109/MDT.2005.149
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