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Demystifying 3D ICs: The Pros and Cons of Going Vertical
November/December 2005 (vol. 22 no. 6)
pp. 498-510
ASCII Text
x 
 
W. Rhett Davis, John Wilson, Stephen Mick, Jian Xu, Hao Hua, Christopher Mineo, Ambarish M. Sule, Michael Steer, Paul D. Franzon, "Demystifying 3D ICs: The Pros and Cons of Going Vertical," IEEE Design & Test of Computers, vol. 22, no. 6, pp. 498-510, November/December, 2005.
 
 
BibTex
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@article{ 10.1109/MDT.2005.136,
author = {W. Rhett Davis and John Wilson and Stephen Mick and Jian Xu and Hao Hua and Christopher Mineo and Ambarish M. Sule and Michael Steer and Paul D. Franzon},
title = {Demystifying 3D ICs: The Pros and Cons of Going Vertical},
journal ={IEEE Design & Test of Computers},
volume = {22},
number = {6},
issn = {0740-7475},
year = {2005},
pages = {498-510},
doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2005.136},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - MGZN
JO - IEEE Design & Test of Computers
TI - Demystifying 3D ICs: The Pros and Cons of Going Vertical
IS - 6
SN - 0740-7475
SP498
EP510
EPD - 498-510
A1 - W. Rhett Davis,
A1 - John Wilson,
A1 - Stephen Mick,
A1 - Jian Xu,
A1 - Hao Hua,
A1 - Christopher Mineo,
A1 - Ambarish M. Sule,
A1 - Michael Steer,
A1 - Paul D. Franzon,
PY - 2005
KW - Parallel I/O
KW - I/O and Data Communications
KW - Transmitters
KW - Receivers
KW - C.0.e System architectures
KW - integration and modeling
KW - Interconnection architectures
KW - Placement and routing
KW - Routing and layout
VL - 22
JA - IEEE Design & Test of Computers
ER -
 
W. Rhett Davis, North Carolina State University
John Wilson, North Carolina State University
Stephen Mick, North Carolina State University
Jian Xu, North Carolina State University
Hao Hua, North Carolina State University
Christopher Mineo, North Carolina State University
Ambarish M. Sule, North Carolina State University
Michael Steer, North Carolina State University
Paul D. Franzon, North Carolina State University
As 3D technologies become technologically viable, there is increasinginterest in determining the achievable payoff. This article first presents an overview of 3D technologies and introduces the motivation for moving from 2D to 3D. It then presents a case study of a fast-Fourier-transform design to illustrate the advantages of going to the third dimension.
Index Terms:
Parallel I/O, I/O and Data Communications , Transmitters, Receivers, C.0.e System architectures, integration and modeling, Interconnection architectures, Placement and routing, Routing and layout
Citation:
W. Rhett Davis, John Wilson, Stephen Mick, Jian Xu, Hao Hua, Christopher Mineo, Ambarish M. Sule, Michael Steer, Paul D. Franzon, "Demystifying 3D ICs: The Pros and Cons of Going Vertical," IEEE Design & Test of Computers, vol. 22, no. 6, pp. 498-510, Nov.-Dec. 2005, doi:10.1109/MDT.2005.136
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