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November/December 2005 (vol. 22 no. 6)
pp. 496-497
Sachin Sapatnekar, University of Minnesota
Although various forms of 3D fabrication technology have existed for a few decades, only in recent years have researchers developed highly integrated 3D design technologies that are potentially manufacturable and economically feasible. Several companies are already marketing 3D structures built by wafer stacking, where the distance between the 3D layers on a wafer are on the order of the wafer thickness. But 3D technology must also surmount several challenges, such as exploiting the design space to build high-performance systems and architectures to gain the fullest advantage achievable. The articles in this special issue highlight these advances and challenges, providing an excellent snapshot of the state of 3D technology as it stands today.
Index Terms:
3D integration, 3D design, wafer stacking, CAD tools, silicon processing, architecture, FPGA
Citation:
Sachin Sapatnekar, Kevin Nowka, "Guest Editors' Introduction: New Dimensions in 3D Integration," IEEE Design & Test of Computers, vol. 22, no. 6, pp. 496-497, Nov.-Dec. 2005, doi:10.1109/MDT.2005.142
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