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Analysis of Error Recovery Schemes for Networks on Chips
September/October 2005 (vol. 22 no. 5)
pp. 434-442
| ASCII Text | x | ||
| Srinivasan Murali, Theocharis Theocharides, N. Vijaykrishnan, Mary Jane Irwin, Luca Benini, Giovanni De Micheli, "Analysis of Error Recovery Schemes for Networks on Chips," IEEE Design & Test of Computers, vol. 22, no. 5, pp. 434-442, September/October, 2005. | |||
| BibTex | x | ||
| @article{ 10.1109/MDT.2005.104, author = {Srinivasan Murali and Theocharis Theocharides and N. Vijaykrishnan and Mary Jane Irwin and Luca Benini and Giovanni De Micheli}, title = {Analysis of Error Recovery Schemes for Networks on Chips}, journal ={IEEE Design & Test of Computers}, volume = {22}, number = {5}, issn = {0740-7475}, year = {2005}, pages = {434-442}, doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2005.104}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, } | |||
| RefWorks Procite/RefMan/Endnote | x | ||
| TY - MGZN JO - IEEE Design & Test of Computers TI - Analysis of Error Recovery Schemes for Networks on Chips IS - 5 SN - 0740-7475 SP434 EP442 EPD - 434-442 A1 - Srinivasan Murali, A1 - Theocharis Theocharides, A1 - N. Vijaykrishnan, A1 - Mary Jane Irwin, A1 - Luca Benini, A1 - Giovanni De Micheli, PY - 2005 KW - Performance and Reliability KW - I/O and Data Communications VL - 22 JA - IEEE Design & Test of Computers ER - | |||
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2005.104
Error resiliency is a must for NoCs, but it must not incur undue costs--particularly in terms of energy consumption. Here, the authors present anauthoritative discussion of the trade-offs involved in various error recoveryschemes, enabling designers to make optimal decisions.
Index Terms:
Performance and Reliability, I/O and Data Communications
Citation:
Srinivasan Murali, Theocharis Theocharides, N. Vijaykrishnan, Mary Jane Irwin, Luca Benini, Giovanni De Micheli, "Analysis of Error Recovery Schemes for Networks on Chips," IEEE Design & Test of Computers, vol. 22, no. 5, pp. 434-442, Sept.-Oct. 2005, doi:10.1109/MDT.2005.104
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