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March/April 2003 (vol. 20 no. 2)
pp. 5-7
Monica Lobetti-Bodoni, Siemens Mobile Communications
R.G.(Ben) Bennetts, Bennetts Associates

Modern, loaded-board assemblies are multilayer constructions, heavily populated by under-the-package bonded devices such as micro ball grid, column grid, and flip-chip arrays. Such boards offer very limited physical access to traditional, in-circuit bed-of-nail testers. Other testissues include defects in buried components; higher operating frequencies than earlier boards, which lower the tolerances on signal integrity; lower power supply voltages; the need for more-accurate thermal analysis; and electromagnetic compatibility. Many systems companies are struggling to design new boards that support prototype board debugging (design verification and defect analysis), manufacturing test for volume production (defect detection and location), systems integration (backplane testing), and field service (fast fault identification and repair).

Citation:
Monica Lobetti-Bodoni, R.G.(Ben) Bennetts, "Guest Editors' Introduction: Board Test," IEEE Design & Test of Computers, vol. 20, no. 2, pp. 5-7, March-April 2003, doi:10.1109/MDT.2003.1188256
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