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Using Atomic Force Microscopy for Deep-Submicron Failure Analysis
January/February 2001 (vol. 18 no. 1)
pp. 10-18
As circuit feature size continues to shrink, we will soon need a failure analysis technique that provides resolutions of 10 nanometers or less. This feasibility study concludes that AFM technology, with reasonable improvements, can take over where focused ion beams leave off.
Citation:
Jien-Chung Lo, William D. Armitage, Corbet S. Johnson, "Using Atomic Force Microscopy for Deep-Submicron Failure Analysis," IEEE Design & Test of Computers, vol. 18, no. 1, pp. 10-18, Jan.-Feb. 2001, doi:10.1109/54.902818
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