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Issue No.04 - October-December (1999 vol.16)
pp: 66-73
ABSTRACT
The gate oxide of complementary metal-oxide semiconductor (CMOS) transistors is critical. Penalties for poor-quality oxides can be severe, impacting test escape, burn-in, and field failure costs. Twenty years ago, oxide thicknesses were about 750 \AA. Now they are 40 \AA, and reductions continue. Gate oxide electric-field intensity is presently higher than burn-in electric-field intensities of 10 years ago. This article discusses the major gate oxide failure modes, reliability modeling, burn-in, and qualification testing. We present a typical method to calculate failure rates.
CITATION
Jaume Segura, Jerry Soden, Ted Dellin, "Test and Reliability: Partners in IC Manufacturing, Part 2", IEEE Design & Test of Computers, vol.16, no. 4, pp. 66-73, October-December 1999, doi:10.1109/54.808215
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