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Issue No.03 - July-September (1998 vol.15)
pp: 35-43
ABSTRACT
<p>The implementation of complex electronic systems using High Density Packaging (HDP) technologies requires an IC-like "first-time right" design approach, as rework and prototyping for such technologies can be extremely expensive. On the other hand, most Multichip Module (MCM) and HDP technologies have not reached a mature stage yet. Highly integrated and versatile MCM design environments, able to provide an automated design data flow and to cope with the required flexibility, are therefore a necessity.</p> <p>One of the most important time-consuming and error-prone tasks in a HDP design flow is the selection of the desired bare die (or minimally packaged) component and the mostly manual data entry in the CAD environment. The outcome of the GOOD-DIE project provides an infrastructure addressing this issue and based on existing standards. A major advantage offered by this solution is the possibility to use it as a corner stone which one can build a complete automated MCM design environment around.</p>
INDEX TERMS
Chip packaging, circuit design, multichip modules, automated design
CITATION
Claudio Truzzi, "The Role of the Good-Die Project in Miniaturized-System Design", IEEE Design & Test of Computers, vol.15, no. 3, pp. 35-43, July-September 1998, doi:10.1109/54.706031
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