This Article 
   
 Share 
   
 Bibliographic References 
   
 Add to: 
 
Digg
Furl
Spurl
Blink
Simpy
Google
Del.icio.us
Y!MyWeb
 
 Search 
   
Tracing the Thermal Behavior of ICs
April-June 1998 (vol. 15 no. 2)
pp. 14-21
Scaling down of ICs and the increased packaging densities resulted in increased concern about thermal issues during the design of ICs and their packages. In this paper the advances in the thermal design, measuring and testing methods of ICs are discussed. After presenting the state-of-the-art in the thermal and electro-thermal simulation and measurement methods the idea and methodological questions of the Design for Thermal Testability (DfTT) are discussed. Thermal characterization problems of IC packages are reviewed shortly.
Index Terms:
Thermal testing, Thermal design, Electro-thermal simulation, CMOS temperature sensor, Design for Thermal Testability (DfTT), Thermal transient testing, Thermal compact models
Citation:
Vladimir Székely, Márta Rencz, Bernard Courtois, "Tracing the Thermal Behavior of ICs," IEEE Design & Test of Computers, vol. 15, no. 2, pp. 14-21, April-June 1998, doi:10.1109/54.679204
Usage of this product signifies your acceptance of the Terms of Use.