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IC Failure Analysis: Magic, Mystery, and Science
July-September 1997 (vol. 14 no. 3)
pp. 59-69

Advancing IC and packaging technologies motivate and direct the future of failure analysis. The authors review current tools and techniques and discuss challenges and opportunities created by the industry's critical need for new diagnosis and failure analysis paradigms.

Citation:
Jerry M. Soden, Richard E. Anderson, Chris L. Henderson, "IC Failure Analysis: Magic, Mystery, and Science," IEEE Design & Test of Computers, vol. 14, no. 3, pp. 59-69, July-Sept. 1997, doi:10.1109/54.605998
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