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Issue No.04 - October/December (1993 vol.10)
pp: 8-17
ABSTRACT
<p>Three example applications of silicon-on-silicon multichip modules are discussed: a module used in a parallel processor, a low-cost silicon module for a high-volume consumer product application, and a high-performance digital telecommunications module. These applications illustrate the changes occurring in this technology and the forces that are driving these changes.</p>
CITATION
Robert C. Frye, King L. Tai, Maureen Y. Lau, Thaddeus J. Gabara, "Trends in Silicon-On-Silicon Multichip Modules", IEEE Design & Test of Computers, vol.10, no. 4, pp. 8-17, October/December 1993, doi:10.1109/54.245959
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