The Community for Technology Leaders
RSS Icon
Subscribe
Issue No.03 - May/June (1989 vol.6)
pp: 58-65
ABSTRACT
<p>A broad-level implementation of signature analysis that uses a built-in test module called a testing switch is presented. It is shown how board designers can incorporate the testing-switch modules to reduce the time it takes to isolate faulty chips. Both the test time and the power overhead are better with the testing-switch implementation than with schemes using built-in logic block observer circuits. The proposed technique is especially useful when boundary scan and self-test cannot be implemented in every chip of a board.</p>
CITATION
Nagesh Vasanthavada, Nick Kanopoulos, "A Built-In Test Module for Fault Isolation", IEEE Design & Test of Computers, vol.6, no. 3, pp. 58-65, May/June 1989, doi:10.1109/54.32413
15 ms
(Ver 2.0)

Marketing Automation Platform Marketing Automation Tool