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Bringing HPC to Engineering Innovation
Jan.-Feb. 2013 (vol. 15 no. 1)
pp. 16-25
ASCII Text
x 
 
Mark S. Shephard, Cameron Smith, John E. Kolb, "Bringing HPC to Engineering Innovation," Computing in Science and Engineering, vol. 15, no. 1, pp. 16-25, Jan.-Feb., 2013.
 
 
BibTex
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@article{ 10.1109/MCSE.2012.128,
author = {Mark S. Shephard and Cameron Smith and John E. Kolb},
title = {Bringing HPC to Engineering Innovation},
journal ={Computing in Science and Engineering},
volume = {15},
number = {1},
issn = {1521-9615},
year = {2013},
pages = {16-25},
doi = {http://doi.ieeecomputersociety.org/10.1109/MCSE.2012.128},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - MGZN
JO - Computing in Science and Engineering
TI - Bringing HPC to Engineering Innovation
IS - 1
SN - 1521-9615
SP16
EP25
EPD - 16-25
A1 - Mark S. Shephard,
A1 - Cameron Smith,
A1 - John E. Kolb,
PY - 2013
KW - Computational modeling
KW - Software
KW - Companies
KW - Industries
KW - Parallel processing
KW - Computers
KW - Licenses
KW - scientific computing
KW - computer-aided design
KW - computer-aided manufacturing
KW - computer-aided engineering
VL - 15
JA - Computing in Science and Engineering
ER -
 
Mark S. Shephard, Rensselaer Polytechnic Institute
Cameron Smith, Rensselaer Polytechnic Institute
John E. Kolb, Rensselaer Polytechnic Institute
Although there's a widespread belief that the effective application of high-performance computing will dramatically increase industrial innovation, progress in this area has been slow and limited because of a combination of technical and economic impediments. Here, such impediments are outlined, along with efforts to address them.
Index Terms:
Computational modeling,Software,Companies,Industries,Parallel processing,Computers,Licenses,scientific computing,computer-aided design,computer-aided manufacturing,computer-aided engineering
Citation:
Mark S. Shephard, Cameron Smith, John E. Kolb, "Bringing HPC to Engineering Innovation," Computing in Science and Engineering, vol. 15, no. 1, pp. 16-25, Jan.-Feb. 2013, doi:10.1109/MCSE.2012.128
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