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Issue No.01 - January (2011 vol.44)
pp: 49-57
Daniel S. Stevenson , RTI International's Center for Materials and Electronic Technologies
Robert O. Conn , RTI International's Center for Materials and Electronic Technologies
Three-dimensional silicon interposers are the basis for an architectural approach that bridges the interconnection density between FR-4 printed circuit boards and silicon ICs. The promise is increased performance and less complexity relative to monolithic silicon-based designs.
3D Silicon interposers, Interconnection architecture, Silicon ICs, Exascale computing
Daniel S. Stevenson, Robert O. Conn, "Bridging the Interconnection Density Gap for Exascale Computation", Computer, vol.44, no. 1, pp. 49-57, January 2011, doi:10.1109/MC.2011.8
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8. C. Hidrovo and K.E. Goodson, Active Microfluidic Cooling of Integrated Circuits, in Electrical, Optical and Thermal Interconnections for 3D Integrated Systems, Artech, 2008, pp. 293-330.
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