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Bridging the Interconnection Density Gap for Exascale Computation
January 2011 (vol. 44 no. 1)
pp. 49-57
Daniel S. Stevenson, RTI International's Center for Materials and Electronic Technologies
Robert O. Conn, RTI International's Center for Materials and Electronic Technologies
Three-dimensional silicon interposers are the basis for an architectural approach that bridges the interconnection density between FR-4 printed circuit boards and silicon ICs. The promise is increased performance and less complexity relative to monolithic silicon-based designs.

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Index Terms:
3D Silicon interposers, Interconnection architecture, Silicon ICs, Exascale computing
Citation:
Daniel S. Stevenson, Robert O. Conn, "Bridging the Interconnection Density Gap for Exascale Computation," Computer, vol. 44, no. 1, pp. 49-57, Jan. 2011, doi:10.1109/MC.2011.8
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