The Community for Technology Leaders
RSS Icon
Subscribe
Issue No.01 - January (2011 vol.44)
pp: 49-57
Daniel S. Stevenson , RTI International's Center for Materials and Electronic Technologies
Robert O. Conn , RTI International's Center for Materials and Electronic Technologies
ABSTRACT
Three-dimensional silicon interposers are the basis for an architectural approach that bridges the interconnection density between FR-4 printed circuit boards and silicon ICs. The promise is increased performance and less complexity relative to monolithic silicon-based designs.
INDEX TERMS
3D Silicon interposers, Interconnection architecture, Silicon ICs, Exascale computing
CITATION
Daniel S. Stevenson, Robert O. Conn, "Bridging the Interconnection Density Gap for Exascale Computation", Computer, vol.44, no. 1, pp. 49-57, January 2011, doi:10.1109/MC.2011.8
REFERENCES
1. E. Vick, S. Goodwin, and D. Temple, "Electrical Demonstration of TSV Interconnects and Multilevel Metalization for 3D Si Interposer Applications," Proc. 43rd Int'l Symp. Microelectronics (IMAPS 10), Int'l Microelectronics and Packaging Soc., 2010, pp. 7-14.
2. P. Kogge et al., "ExaScale Computing Study: Technology Challenges in Achieving Exascale Systems," Sept. 2008; http://users.ece.gatech.edu/mrichard/ExascaleComputingStudyReports exascale_final_report_100208.pdf .
3. J. Kim et al., "Technology-Driven, Highly-Scalable Dragonfly Topology," Proc. 35th Int'l Symp. Computer Architecture (ISCA08), IEEE CS Press, 2008, pp. 77-88.
4. A. Krishnamoorthy et al., "Computer Systems Based on Silicon Photonic Interconnects," Proc. IEEE, July 2009, pp. 1337-1361.
5. F. Liu et al., "Electrical Characterization for 3D Through-Silicon-Vias," Proc. 60th Electrical Components and Technology Conf., IEEE Press, 2010, pp. 1100-1105.
6. Yole Development, "3D Glass and Silicon Interposers: Technologies, Applications, and Markets," Sept. 2010; www.i-micronews.com/reports/3D-Silicon-Glass-Interposers 156.
7. T. Pinguet et al., "40-Gbps Monolithically Integrated Transceivers in CMOS Photonics," Proc. Soc. Photo-Optical Eng. (SPIE 08), vol. 6898, SPIE, 2008, pp. 689805-689805-14.
8. C. Hidrovo and K.E. Goodson, Active Microfluidic Cooling of Integrated Circuits, in Electrical, Optical and Thermal Interconnections for 3D Integrated Systems, Artech, 2008, pp. 293-330.
18 ms
(Ver 2.0)

Marketing Automation Platform Marketing Automation Tool