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| V?clav (Vashek) Maty?š, Dan Cvrcek, Jan Krhovj?, Marek Kumpost, "Authorizing Card Payments with PINs," Computer, vol. 41, no. 2, pp. 64-68, February, 2008. | |||
| BibTex | x | ||
| @article{ 10.1109/MC.2008.40, author = {V?clav (Vashek) Maty?š and Dan Cvrcek and Jan Krhovj? and Marek Kumpost}, title = {Authorizing Card Payments with PINs}, journal ={Computer}, volume = {41}, number = {2}, issn = {0018-9162}, year = {2008}, pages = {64-68}, doi = {http://doi.ieeecomputersociety.org/10.1109/MC.2008.40}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, } | |||
| RefWorks Procite/RefMan/Endnote | x | ||
| TY - MGZN JO - Computer TI - Authorizing Card Payments with PINs IS - 2 SN - 0018-9162 SP64 EP68 EPD - 64-68 A1 - V?clav (Vashek) Maty?š, A1 - Dan Cvrcek, A1 - Jan Krhovj?, A1 - Marek Kumpost, PY - 2008 KW - Chip and PIN technology KW - e-commerce KW - PIN pads VL - 41 JA - Computer ER - | |||
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MC.2008.40
Chip and PIN technology was introduced as a means of decreasing payment-card fraud. However, according to results of a two-phase experiment, the technology makes it easier for thieves to obtain PINs and more difficult for customers to defend against counterfeiting.
1. B. Adida et al., "Phish and Chips—Traditional and New Recipes for Attacking EMV," Proc. 2006 Int'l Workshop Security Protocols, to appear in LNCS, Springer-Verlag.
2. D. Cvrcek, J. Krhovják, and V. Matyáš, "PIN (and Chip) or Signature—Beating the Cheating?" Proc. 2005 Int'l Workshop Security Protocols, LNCS 4631, Springer-Verlag, 2007, pp. 69–75.
3. R. Anderson and M. Bond, "The Man-in-the-Middle Defence," Proc. 2006 Int'l Workshop Security Protocols, to appear in LNCS, Springer-Verlag; www.cl.cam.ac.uk/~rja14/PapersMan-in-the-Middle-Defence.pdf .
Index Terms:
Chip and PIN technology, e-commerce, PIN pads
Citation:
V?clav (Vashek) Maty?š, Dan Cvrcek, Jan Krhovj?, Marek Kumpost, "Authorizing Card Payments with PINs," Computer, vol. 41, no. 2, pp. 64-68, Feb. 2008, doi:10.1109/MC.2008.40
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