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Issue No.04 - April (1993 vol.26)
pp: 82-86
ABSTRACT
<p>The application of advanced electronic packaging and interconnect (EP/I) technology by US Department of Defense's Advance Research Projects Agency are discussed. The EP/I domain includes packages, multichip modules (MCMs), connectors, printed circuit boards (PCBs), boxes, backplanes, and cages. The EP/I physical technologies, including diamond substrates, superconductors, and metal matrix packages, are discussed, and information technologies are described.</p>
CITATION
Lance A. Glasser, "A road map to ARPA involvement in electronic packaging", Computer, vol.26, no. 4, pp. 82-86, April 1993, doi:10.1109/2.206520
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