This Article 
   
 Share 
   
 Bibliographic References 
   
 Add to: 
 
Digg
Furl
Spurl
Blink
Simpy
Google
Del.icio.us
Y!MyWeb
 
 Search 
   
Design for Packageability-Early Consideration of Packaging from a VLSI Designer's Viewpoint
April 1993 (vol. 26 no. 4)
pp. 76-81

Designing VLSI dies without considering packaging issues may result in a suboptimum system. It is argued that before the design of VLSI dies is completed, packaging issues should be evaluated, since they may affect choices in VLSI circuit design and layout. To illustrate this, the design of an image processing chip-set of three integrated circuits for wire-bond printed circuit board (PCB) and flip-chip multichip module deposited (MCM-D) technologies is reviewed. It is shown that the characteristics of these chips vary, since they are designed with different packaging in mind.

Citation:
Peyman H. Dehkordi, Donald W. Bouldin, "Design for Packageability-Early Consideration of Packaging from a VLSI Designer's Viewpoint," Computer, vol. 26, no. 4, pp. 76-81, April 1993, doi:10.1109/2.206519
Usage of this product signifies your acceptance of the Terms of Use.