This Article 
   
 Share 
   
 Bibliographic References 
   
 Add to: 
 
Digg
Furl
Spurl
Blink
Simpy
Google
Del.icio.us
Y!MyWeb
 
 Search 
   
A Multichip Module Design Process for Notebook Computers
April 1993 (vol. 26 no. 4)
pp. 41-49

A packaging system design process for multichip modules (MCMs) is presented. The performance factors, cost factors, alternative packaging technologies, and packaging alternatives for daughter cards are discussed. The process is illustrated by applying to the design of a 80386SL chip that contains a 32-b integer central processing unit (CPU), memory management, bus control, and buffering, and a 82360SL companion chip that contains control functions for the system, I/O, peripherals, power management, and a majority of the glue logic required by the system.

Citation:
Paul D. Franzon, Robert J. Evans, "A Multichip Module Design Process for Notebook Computers," Computer, vol. 26, no. 4, pp. 41-49, April 1993, doi:10.1109/2.206512
Usage of this product signifies your acceptance of the Terms of Use.