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Issue No.04 - April (1993 vol.26)
pp: 30-39
ABSTRACT
<p>Several issues associated with multichip module (MCM) system design are discussed. An early analysis tool for evaluating the tradeoffs between a design and packaging technology is presented. A case study of a possible design point suggested by combining different package elements being used in MCMs settings is included. The case study indicates that the most effective packaging solution for high-performance applications, requiring multichip modules, will likely represent a progression from cofired ceramics (MCM-C) to a thin-film and hybrid cofired ceramic (MCM-D/C) module.</p>
CITATION
David P. LaPotin, Toufie R. Mazzawy, Marlin L. White, "Early Package Analysis: Considerations and Case Study", Computer, vol.26, no. 4, pp. 30-39, April 1993, doi:10.1109/2.206511
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